Invention Grant
- Patent Title: Method for integrating an electronic component into a printed circuit board
- Patent Title (中): 将电子元件集成到印刷电路板中的方法
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Application No.: US12736942Application Date: 2009-05-29
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Publication No.: US08789271B2Publication Date: 2014-07-29
- Inventor: Günther Weichslberger , Arno Kriechbaum , Mike Morianz , Nikolai Haslebner , Johannes Stahr , Fritz Haring , Gerhard Freydl , Andrea Koertvelyessy , Mark Beesley , Andreas Zluc , Wolfgang Schrittwieser
- Applicant: Günther Weichslberger , Arno Kriechbaum , Mike Morianz , Nikolai Haslebner , Johannes Stahr , Fritz Haring , Gerhard Freydl , Andrea Koertvelyessy , Mark Beesley , Andreas Zluc , Wolfgang Schrittwieser
- Applicant Address: AT Leoben-Hinterberg
- Assignee: AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
- Current Assignee: AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben-Hinterberg
- Agency: Jacobson Holman, PLLC.
- Priority: ATGM313/2008 20080530
- International Application: PCT/AT2009/000224 WO 20090529
- International Announcement: WO2009/143550 WO 20091203
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
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