Invention Grant
US08790130B2 Flexible printed circuit (PC) board, junction method thereof, and battery pack using the flexible PC board 有权
使用柔性PC板的柔性印刷电路板(PC)板及其接合方法和电池组

  • Patent Title: Flexible printed circuit (PC) board, junction method thereof, and battery pack using the flexible PC board
  • Patent Title (中): 使用柔性PC板的柔性印刷电路板(PC)板及其接合方法和电池组
  • Application No.: US12285243
    Application Date: 2008-09-30
  • Publication No.: US08790130B2
    Publication Date: 2014-07-29
  • Inventor: Chang-Yong Yun
  • Applicant: Chang-Yong Yun
  • Applicant Address: KR Giheung-gu, Yongin-si, Gyeonggi-do
  • Assignee: Samsung SDI Co., Ltd.
  • Current Assignee: Samsung SDI Co., Ltd.
  • Current Assignee Address: KR Giheung-gu, Yongin-si, Gyeonggi-do
  • Agent Robert E. Bushnell, Esq.
  • Priority: KR10-2007-0110922 20071101
  • Main IPC: H01M10/42
  • IPC: H01M10/42 H01M2/10
Flexible printed circuit (PC) board, junction method thereof, and battery pack using the flexible PC board
Abstract:
A flexible Printed Circuit (PC) board, junction method thereof and battery pack using the flexible PC board prevents cracking of terminal units of a flexible PC board and reducing degradation thereof due to deformation by increasing its tensile strength. The flexible PC board has a multi-layered structure including wiring with terminal units, a first insulating layer and a second insulating layer arranged both over and under the wiring. An end of the second insulating layer is arranged between an end of the terminal units and an end of the first insulating layer.
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