A carrier assembly is provided for solar cell laminates that include an encapsulating layer and that are conveyed through a lamination plant having a conveying surface. The assembly includes a housing of heat conductive material defining an inner volume, the housing having an upper plate for receiving the laminates and a lower plate defining a plurality of apertures, the inner volume including at least one connecting element interconnecting the first and second plates. An air supply system provides a continuous outward air flow through the apertures when the lower plate is received on the conveying surface, wherein the airflow yields an elevated pressure on the lower plate for providing lift to the housing, allowing substantially friction-free movement of the housing relative to the conveying surface. A thermal transfer system provides thermal energy to the upper plate for melting and curing the encapsulating layer.