Invention Grant
- Patent Title: Adhesive composition for labels
- Patent Title (中): 标签用粘合剂组合物
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Application No.: US13255217Application Date: 2010-03-29
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Publication No.: US08791196B2Publication Date: 2014-07-29
- Inventor: Ryouji Oda , Sadaharu Hashimoto
- Applicant: Ryouji Oda , Sadaharu Hashimoto
- Applicant Address: JP Tokyo
- Assignee: Zeon Corporation
- Current Assignee: Zeon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-088574 20090331
- International Application: PCT/JP2010/055581 WO 20100329
- International Announcement: WO2010/113883 WO 20101007
- Main IPC: C08L53/02
- IPC: C08L53/02 ; C09J153/02

Abstract:
Provided is an adhesive composition for labels, which can be easily applied at a relatively low temperature and has satisfactory die cutting properties so that the adhesive composition can contribute to an improvement of the productivity of labels, and which is capable of producing labels having excellent holding power and tackiness. There is disclosed an adhesive composition for labels comprising: a block copolymer A represented by the following general formula (A); a polymer C, which is a polymer having a glass transition temperature of −30° C. or lower, or a block copolymer that has a polymer block having a glass transition temperature of −30° C. or lower at an end of the polymer chain; and a tackifier resin D. Ar1a-Da-Ar2a (A), in the general formula (A), Ar1a represents an aromatic vinyl polymer block having a weight average molecular weight of 6,000 to 20,000; Ar2a represents an aromatic vinyl polymer block having a weight average molecular weight of 22,000 to 400,000; and Da represents a conjugated diene polymer block having a vinyl bond content of 1 mol % to 20 mol %.
Public/Granted literature
- US20110319549A1 ADHESIVE COMPOSITION FOR LABELS Public/Granted day:2011-12-29
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