Invention Grant
- Patent Title: High speed laser scribing method of fragile material
- Patent Title (中): 高速激光划线法脆性材料
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Application No.: US12417112Application Date: 2009-04-02
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Publication No.: US08791385B2Publication Date: 2014-07-29
- Inventor: Yutaka Tamura
- Applicant: Yutaka Tamura
- Applicant Address: JP Takatsuki
- Assignee: Lemi Co., Ltd.
- Current Assignee: Lemi Co., Ltd.
- Current Assignee Address: JP Takatsuki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2008-100887 20080408
- Main IPC: B23K26/36
- IPC: B23K26/36

Abstract:
In a method for scribing fragile material, a laser beam is irradiated onto a work plate of the fragile material. The work plate is heated by absorption of the irradiated laser beam and generating thermal stress by the heating. The laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and the plurality of laser beam groups are divided into two groups. One takes charge of initial heating and rising up temperature of the work plate, and another takes charge of temperature holding of the work plate. The laser beam intensity corresponding to each of the laser beam groups is adjusted so as to obtain optimum values.By the method, it is possible to remarkably increase scribing speed of the work plate of the fragile materials without increasing heating temperature.
Public/Granted literature
- US20100089882A1 HIGH SPEED LASER SCRIBING METHOD OF FRAGILE MATERIAL Public/Granted day:2010-04-15
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