Invention Grant
- Patent Title: Heating substrate equipped with conductive thin film and electrode, and manufacturing method of the same
- Patent Title (中): 配有导电薄膜和电极的加热基板及其制造方法
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Application No.: US12187704Application Date: 2008-08-07
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Publication No.: US08791394B2Publication Date: 2014-07-29
- Inventor: Chang-Soo Han , Jin-Won Song , Joon-Dong Kim , Yu-Hwan Yoon
- Applicant: Chang-Soo Han , Jin-Won Song , Joon-Dong Kim , Yu-Hwan Yoon
- Applicant Address: KR Daejeon
- Assignee: Korea Institute of Machinery & Materials
- Current Assignee: Korea Institute of Machinery & Materials
- Current Assignee Address: KR Daejeon
- Agency: Lexyoume IP Meister, PLLC
- Priority: KR10-2007-0088683 20070831
- Main IPC: H05B3/02
- IPC: H05B3/02 ; H05B3/84 ; H01C1/012

Abstract:
The present invention is to provide a heating substrate equipped with a conductive thin film and electrodes. The heating substrate includes a transparent substrate, a plurality of electrodes formed on a first face of the substrate, and a conductive thin film formed on the first face of the substrate and including a plurality of regions electrically connected each other in parallel by the plurality of electrodes. Furthermore, a method of manufacturing a heating substrate equipped with a conductive thin film and electrodes according to an exemplary embodiment of the present invention includes forming the conductive thin film on a substrate, forming main electrodes so as to extend on the substrate while being adjacent to edges of the conductive thin film, and forming branched electrodes that are extended from the conductive thin film across one side of the conductive thin film while coming in contact with the conductive thin film.
Public/Granted literature
- US20090057295A1 HEATING SUBSTRATE EQUIPPED WITH CONDUCTIVE THIN FILM AND ELECTRODE, AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2009-03-05
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