Invention Grant
US08791443B2 High density variable resistive memory and method of fabricating the same 有权
高密度可变电阻记忆及其制造方法

  • Patent Title: High density variable resistive memory and method of fabricating the same
  • Patent Title (中): 高密度可变电阻记忆及其制造方法
  • Application No.: US13601490
    Application Date: 2012-08-31
  • Publication No.: US08791443B2
    Publication Date: 2014-07-29
  • Inventor: Nam Kyun Park
  • Applicant: Nam Kyun Park
  • Applicant Address: KR Gyeonggi-do
  • Assignee: SK Hynix Inc.
  • Current Assignee: SK Hynix Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Group LLP
  • Priority: KR10-2012-0055456 20120524
  • Main IPC: H01L21/20
  • IPC: H01L21/20
High density variable resistive memory and method of fabricating the same
Abstract:
A high density variable resistive random access memory device and a method of fabricating the same are provided. The device includes first word lines, each separated from each other by a width of first word line; bit lines, each separated from each other by a width of bit line; and second word lines, each located between two adjacent first word lines, wherein the widths of first word line and the bit line are substantially same, and the bit lines are located over the first and second word lines.
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