Invention Grant
- Patent Title: Semiconductor light emitting element having a plurality of substrate cutouts and semiconductor layer side surface projections
- Patent Title (中): 具有多个基板切口和半导体层侧面突起的半导体发光元件
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Application No.: US13693460Application Date: 2012-12-04
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Publication No.: US08791469B2Publication Date: 2014-07-29
- Inventor: Hironao Shinohara , Kensuke Hirano
- Applicant: Toyoda Gosei Co., Ltd.
- Applicant Address: JP Aichi
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-265909 20111205
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/26 ; H01L31/12 ; H01L33/00 ; H01L33/20 ; H01L33/22

Abstract:
In a semiconductor light emitting element (1) having a sapphire substrate (100), and lower (210) and upper (220) semiconductor layers laminated on the sapphire substrate, the substrate includes a substrate top surface (113), a substrate bottom surface (114), first substrate side surfaces (111) and second substrate side surfaces (112); plural first (121a) and second (122a) cutouts are provided at a border between the first substrate side surface, the second substrate side surface and the substrate top surface; the lower semiconductor layer includes a lower semiconductor bottom surface, a lower semiconductor top surface (213), first lower semiconductor side surfaces (211) and second lower semiconductor side surfaces (212); plural first projecting portions (211a) and plural first depressing portions (211b) are provided on the first lower semiconductor side surface; and plural second protruding portions (212a) and second flat portions (212b) are provided on the second lower semiconductor side surface.
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