Invention Grant
US08791530B2 Compliant micro device transfer head with integrated electrode leads
有权
具有集成电极引线的符合标准的微器件传输头
- Patent Title: Compliant micro device transfer head with integrated electrode leads
- Patent Title (中): 具有集成电极引线的符合标准的微器件传输头
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Application No.: US13605959Application Date: 2012-09-06
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Publication No.: US08791530B2Publication Date: 2014-07-29
- Inventor: Andreas Bibl , Dariusz Golda
- Applicant: Andreas Bibl , Dariusz Golda
- Applicant Address: US CA Santa Clara
- Assignee: LuxVue Technology Corporation
- Current Assignee: LuxVue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L27/14
- IPC: H01L27/14
Abstract:
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm.
Public/Granted literature
- US20140064904A1 COMPLIANT MICRO DEVICE TRANSFER HEAD WITH INTEGRATED ELECTRODE LEADS Public/Granted day:2014-03-06
Information query
IPC分类:
