Invention Grant
- Patent Title: Package with a CMOS die positioned underneath a MEMS die
- Patent Title (中): 具有位于MEMS管芯下方的CMOS管芯的封装
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Application No.: US13278351Application Date: 2011-10-21
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Publication No.: US08791531B2Publication Date: 2014-07-29
- Inventor: Peter V. Loeppert , David Giesecke , Anthony Minervini , Jeffrey Niew , Lawrence Grunert
- Applicant: Peter V. Loeppert , David Giesecke , Anthony Minervini , Jeffrey Niew , Lawrence Grunert
- Applicant Address: US IL Itasca
- Assignee: Knowles Electronics, LLC
- Current Assignee: Knowles Electronics, LLC
- Current Assignee Address: US IL Itasca
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: H01L29/82
- IPC: H01L29/82
Abstract:
A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
Public/Granted literature
- US20120161259A1 Package With A CMOS Die Positioned Underneath A MEMS Die Public/Granted day:2012-06-28
Information query
IPC分类:
