Invention Grant
- Patent Title: Power semiconductor module, electric-power conversion apparatus, and railway vehicle
- Patent Title (中): 功率半导体模块,电力转换装置和铁路车辆
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Application No.: US13697804Application Date: 2010-07-01
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Publication No.: US08791662B2Publication Date: 2014-07-29
- Inventor: Takeshi Tanaka
- Applicant: Takeshi Tanaka
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- International Application: PCT/JP2010/061265 WO 20100701
- International Announcement: WO2012/001805 WO 20120105
- Main IPC: H01L25/07
- IPC: H01L25/07 ; H01L25/18

Abstract:
A pair of elements that includes a Si-MOSFET and a Si-FWD connected in inverse parallel and operates as a positive side arm of an electric-power conversion apparatus and a pair of elements that operates as a negative side arm of the electric-power conversion apparatus are provided, where the first and second pairs of elements are accommodated in one power semiconductor module to compose a 2-in-1 module, and terminals are included which enables series connection of the pairs of elements.
Public/Granted literature
- US20130063067A1 POWER SEMICONDUCTOR MODULE, ELECTRIC-POWER CONVERSION APPARATUS, AND RAILWAY VEHICLE Public/Granted day:2013-03-14
Information query
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