While an exposure processing is performed to a wafer held by a fine movement stage supported by a coarse movement stage in an exposure station, at least a part of a measurement processing to a wafer held by another fine movement stage supported by another coarse movement stage and an exchange of a wafer held by yet another fine movement stage on a center table is concurrently performed. Because of this, exposure with a higher throughput becomes possible, even when compared with a conventional exposure apparatus which concurrently performs an exposure processing to a wafer on a wafer stage, and processing such as wafer exchange and alignment on another stage.