Invention Grant
- Patent Title: Light-emitting device and method of manufacturing the same
- Patent Title (中): 发光装置及其制造方法
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Application No.: US13614646Application Date: 2012-09-13
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Publication No.: US08792160B2Publication Date: 2014-07-29
- Inventor: Rintaro Koda , Hideki Watanabe , Masaru Kuramoto , Shunsuke Kono , Takao Miyajima
- Applicant: Rintaro Koda , Hideki Watanabe , Masaru Kuramoto , Shunsuke Kono , Takao Miyajima
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP2011-210355 20110927
- Main IPC: H01S5/22
- IPC: H01S5/22

Abstract:
Provided is a light-emitting device including (a) a layer structure obtained by sequentially growing on a base substrate a first compound semiconductor layer of a first conductivity type, (b) an active layer formed of a compound semiconductor, and (c) a second compound semiconductor layer of a second conductivity type; a second electrode formed on the second compound semiconductor layer; and a first electrode electrically connected to the first compound semiconductor layer. The layer structure formed of at least a part of the second compound semiconductor layer in a thickness direction of the second compound semiconductor layer. The first compound semiconductor layer has a thickness greater than 0.6 μm. A high-refractive index layer formed of a compound semiconductor material having a refractive index higher than a refractive index of a compound semiconductor material of the first compound semiconductor layer is formed in the first compound semiconductor layer.
Public/Granted literature
- US20130075772A1 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-03-28
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