Invention Grant
- Patent Title: Multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子元件
-
Application No.: US13620614Application Date: 2012-09-14
-
Publication No.: US08792223B2Publication Date: 2014-07-29
- Inventor: Hyun Hee Gu , Myung Jun Park , Kyu Ha Lee , Da Young Choi , Jae Young Park , Sang Hoon Kwon , Byung Jun Jeon
- Applicant: Hyun Hee Gu , Myung Jun Park , Kyu Ha Lee , Da Young Choi , Jae Young Park , Sang Hoon Kwon , Byung Jun Jeon
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0070259 20120628
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/00

Abstract:
There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls≦10 μm is satisfied.
Public/Granted literature
- US20140002949A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2014-01-02
Information query