Invention Grant
- Patent Title: In-hierarchy circuit analysis and modification
- Patent Title (中): 分级电路分析和修改
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Application No.: US13971666Application Date: 2013-08-20
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Publication No.: US08793633B1Publication Date: 2014-07-29
- Inventor: Ping-San Tzeng
- Applicant: Atoptech, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Atoptech, Inc.
- Current Assignee: Atoptech, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Van Pelt, Yi & James LLP
- Main IPC: G06F9/455
- IPC: G06F9/455 ; G06F17/50

Abstract:
Modifying a hierarchical circuit design includes: accessing hierarchical circuit data in the hierarchical circuit design; performing timing analysis on a selected portion of the hierarchical circuit data to determine whether inter-block timing closure is achieved; and in the event that inter-block timing closure is not achieved, performing a set of one or more fixes on the selected portion of the hierarchical circuit data to achieve inter-block timing closure. The selected portion of the hierarchical circuit data includes a selected portion of top-level block data and a selected portion of lower-level block data. Accessing hierarchical circuit data, performing timing analysis, and in the event that inter-block timing closure is not achieved, performing the set of one or more fixes are performed within a top-level design process.
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