Invention Grant
US08793849B1 Method of manufacturing high frequency thickness shear mode gas and organic vapor sensors
有权
制造高频厚度剪切模式气体和有机蒸汽传感器的方法
- Patent Title: Method of manufacturing high frequency thickness shear mode gas and organic vapor sensors
- Patent Title (中): 制造高频厚度剪切模式气体和有机蒸汽传感器的方法
-
Application No.: US12478964Application Date: 2009-06-05
-
Publication No.: US08793849B1Publication Date: 2014-08-05
- Inventor: Venkat R. Bhethanabotla , Randolph D. Williams
- Applicant: Venkat R. Bhethanabotla , Randolph D. Williams
- Applicant Address: US FL Tampa
- Assignee: University of South Florida
- Current Assignee: University of South Florida
- Current Assignee Address: US FL Tampa
- Agency: Smith & Hopen, P.A.
- Agent Michele L. Lawson
- Main IPC: H01L41/22
- IPC: H01L41/22 ; G01N29/02

Abstract:
A method of fabricating a thickness shear mode (TSM) gas and organic vapor sensor having a visco-elastic polymer coating and a fundamental frequency greater than 20 MHz. The method begins by providing a piezoelectric crystal and milling a central region of the crystal. Milling the crystal creates a central oscillating region of reduced thickness surrounded by a thicker outer region. Two electrodes are then deposited in the oscillating region of the crystal—one on each side of the crystal. The oscillating region on both sides of the crystal and the electrodes are then coated with a polymer coating.
Information query
IPC分类: