Invention Grant
- Patent Title: Chip embedded substrate and method of producing the same
- Patent Title (中): 芯片嵌入式基板及其制造方法
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Application No.: US13167203Application Date: 2011-06-23
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Publication No.: US08793868B2Publication Date: 2014-08-05
- Inventor: Takaharu Yamano , Hajime Iizuka , Hideaki Sakaguchi , Toshio Kobayashi , Tadashi Arai , Tsuyoshi Kobayashi , Tetsuya Koyama , Kiyoaki Iida , Tomoaki Mashima , Koichi Tanaka , Yuji Kunimoto , Takashi Yanagisawa
- Applicant: Takaharu Yamano , Hajime Iizuka , Hideaki Sakaguchi , Toshio Kobayashi , Tadashi Arai , Tsuyoshi Kobayashi , Tetsuya Koyama , Kiyoaki Iida , Tomoaki Mashima , Koichi Tanaka , Yuji Kunimoto , Takashi Yanagisawa
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Ladas & Parry LLP
- Priority: JP2005-360519 20051214; JP2006-117618 20060421
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.
Public/Granted literature
- US20110256662A1 CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME Public/Granted day:2011-10-20
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