Invention Grant
- Patent Title: Structure for attaching vibration sensor to storage device
- Patent Title (中): 将振动传感器连接到存储装置的结构
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Application No.: US13390606Application Date: 2010-08-09
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Publication No.: US08794073B2Publication Date: 2014-08-05
- Inventor: Shigeru Kasai , Yasuhiro Sasaki , Hiroshi Sakai
- Applicant: Shigeru Kasai , Yasuhiro Sasaki , Hiroshi Sakai
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2009-194587 20090825
- International Application: PCT/JP2010/063468 WO 20100809
- International Announcement: WO2011/024631 WO 20110303
- Main IPC: G01H11/08
- IPC: G01H11/08

Abstract:
A structure for attaching a vibration sensor to a storage device having a recording or reproducing head that records on or reproduces from a recording medium, includes: a first vibration sensor which is provided on a first outer surface of a base of the storage device, and detects vibration in a direction perpendicular to a surface of the recording medium; a second vibration sensor which is provided on a second outer surface of the base, the second surface orthogonal to the first outer surface, and detects vibration in an in-plane direction of the recording medium; an urging section which has a first end portion in contact with an upper surface of the first vibration sensor and a second end portion in contact with an upper surface of the second vibration sensor, and has a substantially L-shape; and a damping member affixed to the urging section.
Public/Granted literature
- US20120137780A1 STRUCTURE FOR ATTACHING VIBRATION SENSOR TO STORAGE DEVICE Public/Granted day:2012-06-07
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