Invention Grant
- Patent Title: Sensor module and method for producing a sensor module
- Patent Title (中): 传感器模块和传感器模块的制造方法
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Application No.: US12610667Application Date: 2009-11-02
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Publication No.: US08794074B2Publication Date: 2014-08-05
- Inventor: Eric Ochs , Frieder Haag , Eckart Schellkes
- Applicant: Eric Ochs , Frieder Haag , Eckart Schellkes
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102008043517 20081106
- Main IPC: G01L19/04
- IPC: G01L19/04
Abstract:
A sensor module is provided having a sensor element, a housing and a substrate, the sensor element being situated on the substrate and the sensor element is provided to be at least partially embedded in the housing; and the sensor module further having a compensation element for compensating for thermal deformations of the housing; the housing being essentially situated between the substrate and the compensation element.
Public/Granted literature
- US20100107769A1 SENSOR MODULE AND METHOD FOR PRODUCING A SENSOR MODULE Public/Granted day:2010-05-06
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