Invention Grant
- Patent Title: Adhesive tape stamp and method for stamping an adhesive tape section onto an object
- Patent Title (中): 胶带印章和将胶带部分冲压到物体上的方法
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Application No.: US12531989Application Date: 2008-03-18
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Publication No.: US08794291B2Publication Date: 2014-08-05
- Inventor: Christoph Boehler , Dieter Lessig
- Applicant: Christoph Boehler , Dieter Lessig
- Applicant Address: DE Fuerth
- Assignee: Boehler GmbH
- Current Assignee: Boehler GmbH
- Current Assignee Address: DE Fuerth
- Agency: Lucas & Mercanti, LLP
- Priority: DE102007014055 20070321
- International Application: PCT/EP2008/002127 WO 20080318
- International Announcement: WO2008/113548 WO 20080925
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; B32B38/04 ; B32B38/10

Abstract:
The invention is based on the aim of providing a novel office tool, and a corresponding method, wherein various application advantages of known office tools are combined. The invention provides an adhesive tape stamp 1 that is configured to implement a course of movement, wherein an adhesive tape section having a defined length is pressed onto an object in a stamping device, having a separating device 12, which is configured and/or disposed in order to separate an adhesive tape end as the adhesive tape section 23 from a continuous adhesive tape 19 at a separation point 22, and having a stamping device 11, wherein the stamping device 11 is configured and/or disposed to press the adhesive tape end and/or the adhesive tape section 23 onto the object in the stamping direction 4.
Public/Granted literature
- US20100108250A1 ADHESIVE TAPE STAMP AND METHOD FOR STAMPING AN ADHESIVE TAPE SECTION ONTO AN OBJECT Public/Granted day:2010-05-06
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