Invention Grant
US08794502B2 Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same
有权
在精细间距PCB上形成焊盘的方法以及使用其的倒装芯片接合半导体的方法
- Patent Title: Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same
- Patent Title (中): 在精细间距PCB上形成焊盘的方法以及使用其的倒装芯片接合半导体的方法
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Application No.: US13760350Application Date: 2013-02-06
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Publication No.: US08794502B2Publication Date: 2014-08-05
- Inventor: Yong Sung Eom , Kwang-Seong Choi , Jung Hyun Noh
- Applicant: Electronics and Telecommuniations Research Institute
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2012-0063792 20120614
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H01L21/44
Abstract:
Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.
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