Invention Grant
- Patent Title: Mounting apparatus
- Patent Title (中): 安装装置
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Application No.: US13392924Application Date: 2009-09-02
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Publication No.: US08794587B2Publication Date: 2014-08-05
- Inventor: Andrew Cant , Philip Twell
- Applicant: Andrew Cant , Philip Twell
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- International Application: PCT/EP2009/061345 WO 20090902
- International Announcement: WO2011/026516 WO 20110310
- Main IPC: F01D9/00
- IPC: F01D9/00

Abstract:
A mounting apparatus includes a mounting pin having first and second ends, and a support having first and second sides. The support includes a passage between the first and second sides for receiving the mounting pin so that the first end of the pin protrudes from the first side and the second end of the pin protrudes from the second side. The second end of the pin engages an article to be mounted by the mounting apparatus. The first end rotates the pin about the axis of the pin to vary the position of a mounted article. A clamping plate clamps the first end of the mounting pin to the first side of the support for securing the rotational position of the pin with respect to the support.
Public/Granted literature
- US20120168601A1 MOUNTING APPARATUS Public/Granted day:2012-07-05
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