Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13566086Application Date: 2012-08-03
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Publication No.: US08794736B2Publication Date: 2014-08-05
- Inventor: Eiichiro Watanabe , Taiki Hanagami
- Applicant: Eiichiro Watanabe , Taiki Hanagami
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-171372 20110804
- Main IPC: B41J2/01
- IPC: B41J2/01 ; B41J2/175 ; B41J2/17

Abstract:
A liquid ejecting head includes: a head main body having a manifold in which ink is retained, a compliance section absorbing a pressure change inside the manifold and a compliance space provided opposite to the compliance section, and discharging liquid from nozzles communicating with the manifold; an air chamber communicating with the compliance space and outside; and a liquid reservoir communicating with a liquid flow path supplying liquid to the manifold and volume of which is larger than the manifold, wherein the air chamber and the ink reservoir are divided by a resin adhesive where water vapor is capable of penetrating.
Public/Granted literature
- US20130033539A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2013-02-07
Information query
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