Invention Grant
- Patent Title: Bin sweep
- Patent Title (中): 斌扫
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Application No.: US13400496Application Date: 2012-02-20
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Publication No.: US08794897B2Publication Date: 2014-08-05
- Inventor: Jason Luster , Todd Maxwell Hall , Daniel Sease , Christopher Ryan King , Derek Jay Hemphill
- Applicant: Jason Luster , Todd Maxwell Hall , Daniel Sease , Christopher Ryan King , Derek Jay Hemphill
- Applicant Address: US IN Milford
- Assignee: CTB Midwest, Inc.
- Current Assignee: CTB Midwest, Inc.
- Current Assignee Address: US IN Milford
- Agent Camille L. Urban; David M. Breiner
- Main IPC: B65G65/00
- IPC: B65G65/00

Abstract:
In accordance with example embodiments, a sweep may include a pivot assembly, a first arm extending from the pivot assembly, a second arm extending from the pivot assembly, a first driving mechanism attached to the first arm, a second driving mechanism attached to the second arm, and a control device configured to control the first driving mechanism and the second driving mechanism. In example embodiments, the control device may be configured to control the first and second driving mechanism based on a detected variable.
Public/Granted literature
- US20130216341A1 Bin Sweep Public/Granted day:2013-08-22
Information query
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