Invention Grant
US08795245B2 Sleeves, manifolds, systems, and methods for applying reduced pressure to a subcutaneous tissue site 有权
用于将减压施加到皮下组织部位的套管,歧管,系统和方法

  • Patent Title: Sleeves, manifolds, systems, and methods for applying reduced pressure to a subcutaneous tissue site
  • Patent Title (中): 用于将减压施加到皮下组织部位的套管,歧管,系统和方法
  • Application No.: US12645146
    Application Date: 2009-12-22
  • Publication No.: US08795245B2
    Publication Date: 2014-08-05
  • Inventor: Barbara Anne Collins
  • Applicant: Barbara Anne Collins
  • Applicant Address: US TX San Antonio
  • Assignee: KCI Licensing, Inc.
  • Current Assignee: KCI Licensing, Inc.
  • Current Assignee Address: US TX San Antonio
  • Main IPC: A61N1/30
  • IPC: A61N1/30 A61M1/00 A61M27/00
Sleeves, manifolds, systems, and methods for applying reduced pressure to a subcutaneous tissue site
Abstract:
The illustrative embodiments described herein are directed to apparatuses, systems, and methods for applying reduced pressure to subcutaneous tissue site. In one illustrative embodiment, the apparatus includes a sleeve adapted for placement at a subcutaneous tissue site. The sleeve is further adapted to receive a manifold. The sleeve may also have an opening operable to transfer reduced pressure from the manifold to the subcutaneous tissue site. In one embodiment, the apparatus may also include a manifold that is insertable into the sleeve. The manifold may include at least one aperture, and may be operable to deliver reduced pressure to the subcutaneous tissue site via at least one aperture.
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