Invention Grant
- Patent Title: Expandable implant system and methods of use
- Patent Title (中): 可扩展植入体系及其使用方法
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Application No.: US13095634Application Date: 2011-04-27
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Publication No.: US08795368B2Publication Date: 2014-08-05
- Inventor: Hai H Trieu , Sachin P. Budhabhatti
- Applicant: Hai H Trieu , Sachin P. Budhabhatti
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/30 ; A61F2/28 ; A61F2/46

Abstract:
An implant includes a first component including a wall that defines a first surface and a second surface. The first surface defines a first opening and the second surface defines a second opening. The second opening is spaced apart from the first opening to define a cavity therebetween. A second component is supported by the first component and configured for movement relative thereto. The second component is movable between a first configuration such that the second component is disposed between the first opening and the second opening within the cavity and a second, expanded configuration such that the second component simultaneously passes through the first and second openings to extend from the cavity. Methods of use are also disclosed.
Public/Granted literature
- US20120277865A1 EXPANDABLE IMPLANT SYSTEM AND METHODS OF USE Public/Granted day:2012-11-01
Information query
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