Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12382222Application Date: 2009-03-11
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Publication No.: US08795433B2Publication Date: 2014-08-05
- Inventor: Tokunobu Akao , Kazuyoshi Yamamoto
- Applicant: Tokunobu Akao , Kazuyoshi Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2008-066043 20080314; JP2008-333178 20081226
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; G06F19/00 ; G05B19/418 ; H01L21/67

Abstract:
There is provided a substrate processing apparatus that can easily grasp the relationship of a defect substrate between plural batches.A substrate processing apparatus 10 includes: a display unit 16; a storage unit that accumulates and stores production information of the substrate for each batch, the production information being produced when the substrate is processed; a selection receiving unit that receives the selection of plural batches stored in the storage unit; and a display control unit that controls such that substrate information is displayed on the display part, the substrate information being information relating to a state in which the substrates are held the substrate holding part in the plural batches received by the selection receiving unit.
Public/Granted literature
- US20090229518A1 Substrate processing apparatus Public/Granted day:2009-09-17
Information query
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