A method of making a construction for an indexable cutter insert, the method including providing a wafer (20) comprising ceramic material, the wafer (20) being substantially unsupported by a cemented carbide substrate and having a mean thickness of at most 2 mm; providing an insert base (30) having proximate and distal major ends (33, 34) connected by peripheral sides (36), the proximate end (33) of the insert base (30) being configured to have at least two corners (35) defined by junctions of the peripheral sides (36); the wafer (20) being configured to have at least two corners (25) corresponding to the two corners (35) of the proximate end (33) of the insert base (30); the method including bonding the wafer (20) to the proximate end (33) by means of a bond material, the corners (25) of the wafer (20) being disposed adjacent the corresponding corners (35) of the proximate end (33) to provide the construction.