Invention Grant
US08795479B2 Wafer clamp assembly for holding a wafer during a deposition process
有权
用于在沉积过程中保持晶片的晶片夹组件
- Patent Title: Wafer clamp assembly for holding a wafer during a deposition process
- Patent Title (中): 用于在沉积过程中保持晶片的晶片夹组件
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Application No.: US11456722Application Date: 2006-07-11
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Publication No.: US08795479B2Publication Date: 2014-08-05
- Inventor: Hermann Bichler , Reinhard Hanzlik , Stefan Fries , Frank Mueller , Heinrich Wachinger
- Applicant: Hermann Bichler , Reinhard Hanzlik , Stefan Fries , Frank Mueller , Heinrich Wachinger
- Applicant Address: DE Freising
- Assignee: Texas Instruments Deutschland GmbH
- Current Assignee: Texas Instruments Deutschland GmbH
- Current Assignee Address: DE Freising
- Agent Alan A. R. Cooper; W. James Brady, III; Frederick J. Telecky, Jr.
- Priority: DE102005032547 20050712
- Main IPC: C23C14/50
- IPC: C23C14/50 ; C23C16/458 ; H01L21/687
Abstract:
A wafer clamp assembly for holding a wafer during a deposition process comprises an outer annular member defining a central recess that has a diameter slightly greater than the diameter of the wafer. A plurality of finger members are carried by the outer annular member and extend radially inwardly from the outer annular member into the central recess, wherein each of the finger members has a free end for contacting the wafer during the deposition process.
Public/Granted literature
- US20070012561A1 WAFER CLAMP ASSEMBLY FOR HOLDING A WAFER DURING A DEPOSITION PROCESS Public/Granted day:2007-01-18
Information query
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