Invention Grant
- Patent Title: Copper electroplating method
- Patent Title (中): 铜电镀方法
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Application No.: US13290520Application Date: 2011-11-07
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Publication No.: US08795505B2Publication Date: 2014-08-05
- Inventor: Myung-Beom Park , Jung-Sik Choi , Ki-Hyeon Kim , Yuji Morishima , Shin-ichi Tanaka , Takashi Yamada , Takehiro Zushi
- Applicant: Myung-Beom Park , Jung-Sik Choi , Ki-Hyeon Kim , Yuji Morishima , Shin-ichi Tanaka , Takashi Yamada , Takehiro Zushi
- Applicant Address: KR Suwon-si, Gyeonggi-do JP Tokyo
- Assignee: Samsung Electronics Co., Ltd.,Adeka Corporation
- Current Assignee: Samsung Electronics Co., Ltd.,Adeka Corporation
- Current Assignee Address: KR Suwon-si, Gyeonggi-do JP Tokyo
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0014764 20110218
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D17/00 ; C25D7/12 ; H01L21/71 ; H01L21/02 ; H01L21/768
Abstract:
A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
Public/Granted literature
- US20120211369A1 COPPER ELECTROPLATING METHOD Public/Granted day:2012-08-23
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