Invention Grant
- Patent Title: Transparent conductive substrate
- Patent Title (中): 透明导电基板
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Application No.: US13696879Application Date: 2011-05-11
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Publication No.: US08795786B2Publication Date: 2014-08-05
- Inventor: Syozou Kawazoe , Kenji Hashimoto
- Applicant: Syozou Kawazoe , Kenji Hashimoto
- Applicant Address: JP Osaka
- Assignee: Meihan Shinku Kogyo Co., Ltd.
- Current Assignee: Meihan Shinku Kogyo Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-109960 20100512
- International Application: PCT/JP2011/060869 WO 20110511
- International Announcement: WO2011/142392 WO 20111117
- Main IPC: H01L33/42
- IPC: H01L33/42

Abstract:
Disclosed are a transparent conductive substrate comprising a transparent conductive thin film layer and a transparent metal oxide layer disposed in this order on one or both surfaces of a substrate, the transparent metal oxide layer having numerous fine pores penetrating from the front surface to the rear surface thereof, and the pore diameters of the pores at the surface that is opposite to the surface that is in contact with the transparent conductive thin film layer being larger than those at the surface that is in contact with the transparent conductive thin film layer; and a method for producing the transparent conductive substrate, comprising forming the transparent metal oxide layer on the surface of the transparent conductive thin film layer or transparent conductive thin film layers by oblique deposition.
Public/Granted literature
- US20130056050A1 TRANSPARENT CONDUCTIVE SUBSTRATE Public/Granted day:2013-03-07
Information query
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