Invention Grant
- Patent Title: Assembly including a compression-molded composite component having a sandwich structure and a unitarily connected second component
- Patent Title (中): 组装包括具有夹层结构和整体连接的第二组分的压模复合组件
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Application No.: US13688972Application Date: 2012-11-29
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Publication No.: US08795807B2Publication Date: 2014-08-05
- Inventor: Darius J. Preisler , Christopher A. Heikkila
- Applicant: Global IP Holdings, LLC
- Applicant Address: US MI Sterling Heights
- Assignee: Global IP Holdings, LLC
- Current Assignee: Global IP Holdings, LLC
- Current Assignee Address: US MI Sterling Heights
- Agency: Brooks Kushman P.C.
- Main IPC: B32B3/26
- IPC: B32B3/26 ; B32B3/12 ; B32B3/06 ; B32B7/06 ; B62D25/00 ; B32B7/08 ; B32B7/04 ; B62D25/20

Abstract:
A unitary structural assembly including a first component having a plateau-receiving aperture and a compression-molded, composite second component having a sandwich structure is provided. The second component includes a first outer layer, a second outer layer, and a core positioned between the outer layers and having a large number of cavities. The outer layers are bonded to the core by a press molding. A portion of the second component including the first layer and the core defines a raised plateau having upper and side surfaces. The plateau has a size and shape corresponding to the size and shape of the plateau-receiving aperture. A height of the plateau corresponds to the depth of the plateau-receiving aperture. The plateau is inserted into the plateau-receiving aperture so that corresponding surfaces of the plateau and the plateau-receiving aperture are in abutting engagement to unitarily connect the components and form the assembly.
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