Invention Grant
US08795945B2 Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern forming method using the same
有权
光敏性或辐射敏感性树脂组合物，以及使用其的抗蚀剂膜和图案形成方法
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern forming method using the same
- Patent Title (中): 光敏性或辐射敏感性树脂组合物，以及使用其的抗蚀剂膜和图案形成方法
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Application No.: US13521332Application Date: 2011-03-04
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Publication No.: US08795945B2Publication Date: 2014-08-05
- Inventor: Kana Fujii , Takamitsu Tomiga , Toru Fujimori
- Applicant: Kana Fujii , Takamitsu Tomiga , Toru Fujimori
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-053844 20100310
- International Application: PCT/JP2011/055717 WO 20110304
- International Announcement: WO2011/111805 WO 20110915
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition, and a resist film and a pattern forming method using the composition are provided, the composition including (A) a compound capable of decomposing by the action of an acid to increase the solubility of the resin (A) in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a basic compound; and (D) a specific compound containing at least two specific alicyclic hydrocarbon groups each substituted with a hydroxyl group.
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