Invention Grant
- Patent Title: Semiconductor structure
- Patent Title (中): 半导体结构
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Application No.: US13287575Application Date: 2011-11-02
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Publication No.: US08796058B2Publication Date: 2014-08-05
- Inventor: Russell T. Herrin , Daniel R. Miga , Anthony K. Stamper
- Applicant: Russell T. Herrin , Daniel R. Miga , Anthony K. Stamper
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/02
Abstract:
Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.
Public/Granted literature
- US20130105920A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2013-05-02
Information query
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