Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed

Invention Grant

US08796059B2 Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed 有权

Title translation: 一种形成电子器件的方法，包括形成保护封装以容纳附着于其上的衬底和裸片，同时使裸片的第一和第二有源表面部分露出

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Patent Title: Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed
Patent Title (中): 一种形成电子器件的方法，包括形成保护封装以容纳附着于其上的衬底和裸片，同时使裸片的第一和第二有源表面部分露出
Application No.: US13358318

Application Date: 2012-01-25
Publication No.: US08796059B2

Publication Date: 2014-08-05
Inventor: Lorenzo Baldo , Chantal Combi , Mario Francesco Cortese
Applicant: Lorenzo Baldo , Chantal Combi , Mario Francesco Cortese
Applicant Address: IT Agrate Brianza (MB)
Assignee: STMicroelectronics S.r.l.
Current Assignee: STMicroelectronics S.r.l.
Current Assignee Address: IT Agrate Brianza (MB)
Agency: Graybeal Jackson LLP
Priority: ITMI2007A0099 20070124
Main IPC: H01L21/58
IPC: H01L21/58 ; H01L29/84

Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed

Abstract:

Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.

Abstract(Chinese):

包括设置有至少一个通过开口的基板的电子设备，具有差分传感器的MEMS装置，其具有第一和第二表面，所述第一和第二表面具有至少一部分，其对于与第一和第二表面相对应地存在的流体的化学和/或物理变化敏感; 其第二相对的有效表面。离开第一有源表面的MEMS器件的第一表面暴露，并且第二表面设置有暴露所述第二相对的有源表面的另一开口，该电子器件的特征在于，MEMS器件的第一表面面向衬底，并且是与其隔开预定距离，敏感部分与衬底的通过开口对准，并且其还包括至少部分地结合MEMS器件和衬底的保护封装。

Public/Granted literature

US20120164775A1 ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES Public/Granted day:2012-06-28

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/50	...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的
H01L21/58	....半导体器件在支架上的安装