Invention Grant
- Patent Title: Module assembly for thin solar cells
- Patent Title (中): 薄型太阳能电池组件
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Application No.: US13725644Application Date: 2012-12-21
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Publication No.: US08796061B2Publication Date: 2014-08-05
- Inventor: Gabriela Bunea
- Applicant: Gabriela Bunea
- Applicant Address: US CA San Jose
- Assignee: SunPower Corporation
- Current Assignee: SunPower Corporation
- Current Assignee Address: US CA San Jose
- Agency: Okamoto & Benedicto LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/0203

Abstract:
Solar cells are packaged by placing the solar cells between sheets of encapsulants. The encapsulants are exposed to ultraviolet (UV) light to cure the encapsulants and bond the encapsulants together to encapsulate the solar cells. The UV curing steps may be performed to bond one of the encapsulants to a transparent top cover and the solar cells, and to bond the other encapsulant to the solar cells and a backsheet. A protective package that includes the transparent top cover, encapsulated solar cells, and the backsheet is then optionally mounted on a frame.
Public/Granted literature
- US20140179050A1 MODULE ASSEMBLY FOR THIN SOLAR CELLS Public/Granted day:2014-06-26
Information query
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