Invention Grant
- Patent Title: Conditioner for electroless plating
- Patent Title (中): 无电镀护发素
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Application No.: US12590056Application Date: 2009-11-02
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Publication No.: US08796374B2Publication Date: 2014-08-05
- Inventor: Katsuhiro Yoshida
- Applicant: Katsuhiro Yoshida
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Priority: JP2008-281399 20081031
- Main IPC: C08K3/28
- IPC: C08K3/28
Abstract:
A conditioner, surface treatment method, and metal plating film forming method for a moist method of providing a plating film with strong adhesion towards a surface with low roughness without forming a metal film or performing an adhesion promoter pretreatment using a wet method, when plating a resin substrate containing a blend of resin material and glass material, and the like.
Public/Granted literature
- US20100120962A1 Conditioner for electroless plating Public/Granted day:2010-05-13
Information query
