Invention Grant
- Patent Title: Pressure-sensitive hot-melt adhesives adhering to flexible substrates
- Patent Title (中): 粘合在柔性基材上的压敏热熔胶
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Application No.: US12464131Application Date: 2009-05-12
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Publication No.: US08796377B2Publication Date: 2014-08-05
- Inventor: Holger Tönniessen , Annie Seiler , Rainer Rauberger , Ralf Grauel
- Applicant: Holger Tönniessen , Annie Seiler , Rainer Rauberger , Ralf Grauel
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGAA
- Current Assignee: Henkel AG & Co. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: DE102006054196 20061115
- Main IPC: C08L53/00
- IPC: C08L53/00
Abstract:
The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.
Public/Granted literature
- US20090270540A1 PRESSURE-SENSITIVE HOT-MELT ADHESIVES ADHERING TO FLEXIBLE SUBSTRATES Public/Granted day:2009-10-29
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