Invention Grant
- Patent Title: Encapsulated cure systems
- Patent Title (中): 封装治疗系统
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Application No.: US13235357Application Date: 2011-09-17
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Publication No.: US08796381B2Publication Date: 2014-08-05
- Inventor: Todd Arlin Schwantes , Michael Curley Krzoska , Gregory Stephen Kulibert , Adam Gregg Malofsky , Bernard Miles Malofsky , Nagib Maurice Ward
- Applicant: Todd Arlin Schwantes , Michael Curley Krzoska , Gregory Stephen Kulibert , Adam Gregg Malofsky , Bernard Miles Malofsky , Nagib Maurice Ward
- Applicant Address: US WI Appleton
- Assignee: Appvion, Inc.
- Current Assignee: Appvion, Inc.
- Current Assignee Address: US WI Appleton
- Agency: IP&L Solutions
- Agent Edward K. Welch, II
- Main IPC: C09J129/04
- IPC: C09J129/04 ; C08L79/04 ; B32B15/02 ; C08J3/24 ; B01J13/02
Abstract:
Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive systems incorporating said encapsulated cure systems.
Public/Granted literature
- US20120010364A1 ENCAPSULATED CURE SYSTEMS Public/Granted day:2012-01-12
Information query
IPC分类:
