The polyimide precursor composition of the present invention is characterized in comprising a polyimide precursor having a structure formed by reacting a diamine component (A) containing a fluorine-containing aromatic diamine (a1) represented by the following chemical formula (I) (in the formula (I), R1 and R2 are each independently selected from —H, —(CF2)n—CF3, and —O(CF2)n—CF3 (n is an integer of 0 or more and 7 or less), and at least one of R1 and R2 is a fluorine-containing group) and trans-1,4-cyclohexyldiamine (a2) with an acid dianhydride component (B) containing an aliphatic tetracarboxylic dianhydride (b1) and an aromatic tetracarboxylic dianhydride (b2). Use of the composition of the present invention provides a polyimide film and a transparent flexible film having high transparency, low thermal expansion properties, low birefringent properties, and high heat resistance.