Invention Grant
- Patent Title: Electrical circuit assemblies and structural components incorporating same
- Patent Title (中): 电路组件和结合组件的结构组件
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Application No.: US13003174Application Date: 2009-07-07
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Publication No.: US08796553B2Publication Date: 2014-08-05
- Inventor: Martyn John Hucker , Sajad Haq , Michael Dunleavy , David William Gough , Jason Karl Rew , Philip Lawrence Webberley
- Applicant: Martyn John Hucker , Sajad Haq , Michael Dunleavy , David William Gough , Jason Karl Rew , Philip Lawrence Webberley
- Applicant Address: GB London
- Assignee: BAE Systems PLC
- Current Assignee: BAE Systems PLC
- Current Assignee Address: GB London
- Agency: Buchanan Ingersoll & Rooney P.C.
- Priority: GB0812483.6 20080708
- International Application: PCT/GB2009/050799 WO 20090707
- International Announcement: WO2010/004323 WO 20100114
- Main IPC: H01B5/00
- IPC: H01B5/00 ; B05D5/12 ; C25D5/02 ; C25D7/06
Abstract:
Composite structural components are disclosed that include electrically conducting fibers providing multiple signal or paths to electrical components disposed on or adjacent the material. The signal paths may therefore be embedded in the structural component as an intrinsic reinforcing element. Also disclosed are materials for making up the structure and fabrics and methods for the production thereof.
Public/Granted literature
- US20110120750A1 ELECTRICAL CIRCUIT ASSEMBLIES AND STRUCTURAL COMPONENTS INCORPORATING SAME Public/Granted day:2011-05-26
Information query
