Invention Grant
- Patent Title: Connection structure, power module and method of manufacturing the same
- Patent Title (中): 连接结构，电源模块及制造方法相同
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Application No.: US12696762Application Date: 2010-01-29
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Publication No.: US08796563B2Publication Date: 2014-08-05
- Inventor: Ukyo Ikeda , Masato Nakamura , Shiro Yamashita
- Applicant: Ukyo Ikeda , Masato Nakamura , Shiro Yamashita
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: JP2009-030979 20090213; JP2009-118448 20090515
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H05K1/03 ; H05K1/16 ; H05K1/11 ; H01L23/48 ; H01L29/40 ; H05K7/10
Abstract:
In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability.
Public/Granted literature
- US20100206632A1 Connection Structure, Power Module and Method of Manufacturing the Same Public/Granted day:2010-08-19
Information query
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