Invention Grant
- Patent Title: Implementing selective rework for chip stacks and silicon carrier assemblies
- Patent Title (中): 对芯片堆栈和硅载体组件实施选择性返工
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Application No.: US13869658Application Date: 2013-04-24
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Publication No.: US08796578B2Publication Date: 2014-08-05
- Inventor: Gerald K. Bartley , Darryl J. Becker , Philip R. Germann , Andrew B. Maki
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joan Pennington
- Main IPC: B23K1/018
- IPC: B23K1/018 ; B23K3/047
Abstract:
A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.
Public/Granted literature
- US20130233832A1 IMPLEMENTING SELECTIVE REWORK FOR CHIP STACKS AND SILICON CARRIER ASSEMBLIES Public/Granted day:2013-09-12
Information query
IPC分类:
