Invention Grant
US08796583B2 Method of forming a structured surface using ablatable radiation sensitive material
有权
使用可消融的辐射敏感材料形成结构化表面的方法
- Patent Title: Method of forming a structured surface using ablatable radiation sensitive material
- Patent Title (中): 使用可消融的辐射敏感材料形成结构化表面的方法
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Application No.: US10944586Application Date: 2004-09-17
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Publication No.: US08796583B2Publication Date: 2014-08-05
- Inventor: M. Zaki Ali , Elsie A. Fohrenkamm , Richard R. Ollmann, Jr. , Gregory L. Zwadlo
- Applicant: M. Zaki Ali , Elsie A. Fohrenkamm , Richard R. Ollmann, Jr. , Gregory L. Zwadlo
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent Nelson Adrian Blish
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
A structured surface is formed with the method of the present invention. The method of making this structured surface includes the steps of applying an ablatable radiation sensitive coating on the major surface of the substrate, and exposing the ablatable radiation sensitive coating to radiation such that exposed portions of the ablatable radiation sensitive coating ablate from the substrate to form a structured surface. The structured surface then includes a substrate and a pattern of structures framed by at least one separation bank. The method may also include the steps of depositing a flowable material on to the structures and the separation bank to form a pattern of flowable material in the structures.
Public/Granted literature
- US20060063111A1 Method of forming a structured surface using ablatable radiation sensitive material Public/Granted day:2006-03-23
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