Invention Grant
- Patent Title: Processing system with the dual end-effector handling
- Patent Title (中): 具有双末端执行器处理的加工系统
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Application No.: US10483793Application Date: 2002-07-13
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Publication No.: US08796589B2Publication Date: 2014-08-05
- Inventor: Efrain Quiles , Mehran Behdjat , Robert B. Lowrance , Michael Robert Rice , Brent Vopat
- Applicant: Efrain Quiles , Mehran Behdjat , Robert B. Lowrance , Michael Robert Rice , Brent Vopat
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- International Application: PCT/US02/22006 WO 20020713
- International Announcement: WO03/009346 WO 20030130
- Main IPC: B65H1/00
- IPC: B65H1/00 ; F27B5/14
Abstract:
In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of opening through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a second one of the plurality of openings; and (4) a wafer handler contained within the chamber, having a substrate clamping blade and a blade adapted to transport high temperature substrates.
Public/Granted literature
- US20050072716A1 Processing system Public/Granted day:2005-04-07
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