Invention Grant
US08796666B1 MOS devices with strain buffer layer and methods of forming the same
有权
具有应变缓冲层的MOS器件及其形成方法
- Patent Title: MOS devices with strain buffer layer and methods of forming the same
- Patent Title (中): 具有应变缓冲层的MOS器件及其形成方法
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Application No.: US13871739Application Date: 2013-04-26
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Publication No.: US08796666B1Publication Date: 2014-08-05
- Inventor: Yu-Lien Huang , Tung Ying Lee , Chung-Hsien Chen , Chi-Wen Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
A device includes a substrate, insulation regions extending into the substrate, and a semiconductor fin higher than top surfaces of the insulation regions. The semiconductor fin has a first lattice constant. A semiconductor region includes sidewall portions on opposite sides of the semiconductor fin, and a top portion over the semiconductor fin. The semiconductor region has a second lattice constant different from the first lattice constant. A strain buffer layer is between and contacting the semiconductor fin and the semiconductor region. The strain buffer layer includes an oxide.
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