Invention Grant
- Patent Title: Thin-film semiconductor device and method for fabricating thin-film semiconductor device
- Patent Title (中): 薄膜半导体器件及薄膜半导体器件的制造方法
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Application No.: US13997802Application Date: 2012-10-23
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Publication No.: US08796692B2Publication Date: 2014-08-05
- Inventor: Arinobu Kanegae , Takahiro Kawashima
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-236725 20111028
- International Application: PCT/JP2012/006771 WO 20121023
- International Announcement: WO2013/061574 WO 20130502
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/336 ; H01L29/66 ; H01L27/32

Abstract:
A thin-film semiconductor device includes: a gate electrode; a channel layer; a first amorphous semiconductor layer; a channel protective layer; a pair of second amorphous semiconductor layers formed on side surfaces of the channel layer; and a pair of contact layers which contacts the side surfaces of the channel layer via the second amorphous semiconductor layers. The gate electrode, the channel layer, the first amorphous semiconductor layer, and the channel protective layer are stacked so as to have outlines that coincide with one another in a top view. The first amorphous semiconductor layer has a density of localized states higher than those of the second amorphous semiconductor layers. The second amorphous semiconductor layers have band gaps larger than that of the first amorphous semiconductor layer.
Public/Granted literature
- US20140054590A1 THIN-FILM SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THIN-FILM SEMICONDUCTOR DEVICE Public/Granted day:2014-02-27
Information query
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