Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12407048Application Date: 2009-03-19
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Publication No.: US08796694B2Publication Date: 2014-08-05
- Inventor: Tetsuo Hatakeyama , Takashi Shinohe
- Applicant: Tetsuo Hatakeyama , Takashi Shinohe
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2008-249163 20080926
- Main IPC: H01L29/15
- IPC: H01L29/15

Abstract:
A semiconductor device includes a semiconductor substrate made of silicon carbide and having a surface, a normal vector for the surface having an off angle with respect to a direction or a direction, a semiconductor layer of a first conductivity type formed on the semiconductor substrate, a first semiconductor region of a second conductivity type formed in a surface region of the semiconductor layer, a source region of a first conductivity type formed in a surface region of the first semiconductor region, a second semiconductor region of a second conductivity type formed in the surface region of the semiconductor layer, contacting the first semiconductor region, and having a bottom surface lower than a bottom surface of the first semiconductor region, wherein at least one end of the bottom surface of the second semiconductor region is perpendicular to an off angle direction.
Public/Granted literature
- US08629456B2 Semiconductor device Public/Granted day:2014-01-14
Information query
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