Invention Grant
- Patent Title: Light-emitting element
- Patent Title (中): 发光元件
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Application No.: US13137690Application Date: 2011-09-02
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Publication No.: US08796711B2Publication Date: 2014-08-05
- Inventor: Taichiroo Konno
- Applicant: Taichiroo Konno
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-229704 20101012
- Main IPC: H01L33/10
- IPC: H01L33/10

Abstract:
A light-emitting element includes a semiconductor substrate, a light emitting portion including an active layer, a reflective portion between the semiconductor substrate and the light emitting portion, and a current dispersion layer on the light emitting portion. The reflective portion includes a plurality of pair layers each including a first semiconductor layer and a second semiconductor layer. The first semiconductor layer has a thickness TA1 defined by a formula (1) and the second semiconductor layer has a thickness TB1 defined by a formula (2), where λP represents a peak wavelength of the light emitted from the active layer, nA represents a refractive index of the first semiconductor layer, nB represents a refractive index of the second semiconductor layer, nIn represents a refractive index of a first cladding layer, and θ represents an incident angle of light from the first cladding layer to the second semiconductor layer. T A 1 = λ p 4 n A 1 - ( n In sin θ n A ) 2 Formula ( 1 ) T B 1 = λ p 4 n B 1 - ( n In sin θ n B ) 2 Formula ( 2 )
Public/Granted literature
- US20120086030A1 Light-emitting element Public/Granted day:2012-04-12
Information query
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