Invention Grant
- Patent Title: Light-emitting diode package and manufacturing method thereof
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US13495664Application Date: 2012-06-13
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Publication No.: US08796717B2Publication Date: 2014-08-05
- Inventor: Kyung Ho Shin
- Applicant: Kyung Ho Shin
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2006-0020305 20060303
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/64 ; H01L33/48
Abstract:
An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
Public/Granted literature
- US20120248488A1 Light-Emitting Diode Package and Manufacturing Method Thereof Public/Granted day:2012-10-04
Information query
IPC分类:
